https://www.masterbond.com/underfill/encapsulants
AdEpoxy underfill systems for chip scale packaging, ball grid arrays & flip chip. B2B only. Free quotes and technical expertise.
B2B Adhesive Experts · Over 3000 formulations · Factory direct · Tech support to Engineers
Types: Epoxy Adhesives, Silicone Adhesives, UV Curable Adhesives, Industrial Coatings